Production method for laminated ceramic electronic component

ABSTRACT

It is an object of the present invention is to provide a method for manufacturing a multi-layered ceramic electronic component which can reliably prevent a multi-layered unit including a ceramic green sheet and an electrode layer from being damaged and efficiently laminate a desired number of the multi-layered units, thereby manufacturing the multi-layered ceramic electronic component. The method for manufacturing a multi-layered ceramic electronic component according to the present invention includes a step of laminating a plurality of multi-layered units each formed by laminating a release layer, an electrode layer and a ceramic green sheet on a support sheet in this order, the method further including steps of positioning the multi-layered unit on a base substrate so that the surface of the ceramic green sheet is contact with an agglutinant layer formed on the surface of the base substrate in such a manner that the bonding strength between itself and the support substrate is higher than the bonding strength between the support sheet and the release layer and lower than the bonding strength between itself and the ceramic green sheet, pressing it and laminating multi-layered units on the base substrate.

BACKGROUND OF THE INVENTION

The present invention relates to a method for manufacturing amulti-layered ceramic electronic component, and particularly to a methodfor manufacturing the multi-layered ceramic electronic component whichcan reliably prevent a multi-layered unit including a ceramic greensheet and an electrode layer from being damaged and efficiently laminatea desired number of the multi-layered units, thereby manufacturing themulti-layered ceramic electronic component.

DESCRIPTION OF THE PRIOR ART

Recently, the need to downsize various electronic devices makes itnecessary to downsize the electronic components incorporated in thedevices and improve the performance thereof. Also in multi-layeredceramic electronic components, such as multi-layered ceramic capacitors,it is strongly required to increase the number of layers and make thelaminated unit thinner.

When a multi-layered ceramic electronic component as typified by amulti-layered ceramic capacitor is to be manufactured, ceramic powders,a binder such as an acrylic resin, a butyral resin or the like, aplasticizing agent such as a phthalate ester, glycol, adipate ester,phosphate ester or the like, and an organic solvent such as toluene,methyl ethyl ketone, acetone or the like are mixed and dispersed,thereby preparing a dielectric paste.

The dielectric paste is then applied onto a support sheet made ofpolyethylene terephthalate (PET), polypropylene (PP) or the like usingan extrusion coater, a gravure coater or the like to form a coatinglayer and the coating layer is heated to dryness, thereby fabricating aceramic green sheet.

Further, an electrode paste such as of nickel is printed onto theceramic green sheet in a predetermined pattern using a screen printerand is dried to form an electrode layer.

When the electrode layer has been formed, the ceramic green sheet onwhich the electrode layer is formed is peeled off from the support sheetto form a multi-layered unit including the ceramic green sheet and theelectrode layer. Then, a ceramic green chip is formed by laminating adesired number of the multi-layered units to form the laminated body,pressing the laminated body and dicing the laminated body.

Finally, the binder is removed from the green chip, the green chip isbaked and an external electrode is formed, thereby completing amulti-layered ceramic electronic component such as a multi-layeredceramic capacitor.

At present, the need to downsize electronic components and improve theperformance thereof makes it necessary to set the thickness of theceramic green sheet determining the spacing between layers of amulti-layered ceramic capacitor to be equal to or smaller than 3 μm or 2μm and to laminate three hundred or more multi-layered units eachincluding a ceramic green sheet and an electrode layer.

As a result, in the case of laminating the required number ofmulti-layered units each including a ceramic green sheet and anelectrode layer on the outer layer of a multi-layered ceramic capacitorin a conventional manner, the multi-layered unit first laminated on theouter layer is pressed three hundred times or more and is liable to bedamaged. Therefore, it is necessary to laminate multi-layered unitsfifty by fifty, for example, to form multi-layered blocks and laminate aplurality of multi-layered blocks on the outer layer of a multi-layeredceramic capacitor.

In the case of laminating the required number of multi-layered unitseach including a ceramic green sheet and an electrode layer on the outerlayer of a multi-layered ceramic capacitor, the multi-layered units canbe laminated by fixing the outer layer on a die. However, in the case oflaminating multi-layered units to each other, when a multi-layered unitincluding a ceramic green sheet and an electrode layer is fixed on a dieand multi-layered units are laminated thereonto, there arises a highrisk of damaging the multi-layered units.

SUMMARY OF THE INVENTION

It is therefore an object of the present invention to provide a methodfor manufacturing a multi-layered ceramic electronic component which canreliably prevent a multi-layered unit including a ceramic green sheetand an electrode layer from being damaged and efficiently laminate adesired number of the multi-layered units, thereby manufacturing themulti-layered ceramic electronic component.

The above object of the present invention can be accomplished by amethod for manufacturing a multi-layered ceramic electronic component bylaminating a plurality of multi-layered units each formed by laminatinga release layer, an electrode layer and a ceramic green sheet on asupport sheet in this order, the method comprising steps of positioningthe multi-layered unit on a base substrate so that the surface of theceramic green sheet of the multi-layered unit is contact with anagglutinant layer formed on the surface of the base substrate in such amanner that the bonding strength between itself and the supportsubstrate is higher than the bonding strength between the support sheetand the release layer and lower than the bonding strength between itselfand the ceramic green sheet, pressing it and laminating multi-layeredunits on the base substrate.

According to the present invention, since the multi-layered units arelaminated by positioning the multi-layered unit on the base substrate sothat the surface of the ceramic green sheet is contact with anagglutinant layer formed on the surface of the base substrate in such amanner that the bonding strength between itself and the supportsubstrate is higher than the bonding strength between the support sheetand the release layer and lower than the bonding strength between itselfand the ceramic green sheet, pressing it and laminating multi-layeredunits on the base substrate, it is possible to effectively prevent themulti-layered units from being damaged when a multi-layered ceramicelectronic component is manufactured by laminating a desired number ofmulti-layered units.

Further, according to the present invention, since the agglutinant layeris formed on the base sheet in such a manner that the bonding strengthbetween itself and the base substrate is higher than the bondingstrength between the support sheet and the release layer, it is possibleto easily peel off the support sheet from the release layer of themulti-layered unit laminated on the base substrate and it is thereforepossible to efficiently laminate another multi-layered unit on therelease layer of the multi-layered units laminated on the basesubstrate.

Moreover, according to the present invention, since the agglutinantlayer is formed on the base substrate in such a manner that the bondingstrength between itself and the support substrate is lower the bondingstrength between itself and the ceramic green sheet, it is possible topeeling off and remove only the base substrate from the release layerwhile the agglutinant layer is bonded to the ceramic green sheet byrepeating a step of peeling off the support sheet from the release layerof the multi-layered unit laminated on the base substrate and laminatinganother multi-layered unit including an adhesive layer formed on thesurface of the ceramic green sheet on the release layer of themulti-layered unit laminated on the base substrate via the agglutinantlayer to fabricate a multi-layered block including a predeterminednumber of multi-layered units laminated on the base substrate andlaminating the multi-layered block on the outer layer of a multi-layeredceramic capacitor or the like. Therefore, when a multi-layered block isto be further laminated on the multi-layered block laminated on theouter layer of a multi-layered ceramic capacitor or the like, since itis unnecessary to form an adhesive layer on the multi-layered block tobe laminated, it is possible to efficiently manufacture a multi-layeredceramic electronic component.

In the present invention, the dielectric paste used for forming theceramic green sheet is normally prepared by kneading a dielectric rawmaterial and an organic vehicle obtained by dissolving a binder into anorganic solvent.

The dielectric raw material can be selected from among various compoundscapable of forming a composite oxide or oxide, such as a carbonate,nitrate, hydroxide, organic metallic compound and the like and mixturesthereof. The dielectric raw material is normally used in the form of apowder whose average particle diameter is about 0.1 μm to about 3.0 μm.The particle diameter of the dielectric raw material is preferablysmaller than the thickness of the ceramic green sheet.

The binder used for preparing the organic vehicle is not particularlylimited and various known binders such as ethylcellulose, polyvinylbutyral, acrylic resin can be used as the binder for preparing theorganic vehicle. However, in order to make the ceramic green sheetthinner, a butyral system resin such as polyvinyl butyral is preferablyemployed.

The organic solvent used for preparing the organic vehicle is notparticularly limited and terpineol, butyl carbitol, acetone, toluene andthe like can be used as the organic solvent used for preparing theorganic vehicle.

In the present invention, the dielectric paste may be prepared bykneading the dielectric raw material and a vehicle prepared bydissolving a water soluble binder therein.

The water soluble binder used for preparing the dielectric paste is notparticularly limited and polyvinyl alcohol, methylcellulose,hydroxyethylcellulose, water soluble acrylic resin, emulsion and thelike may be used as the water soluble binder.

The amounts of the respective constituents contained in the dielectricpaste are not particularly limited and the dielectric paste may beprepared so as to contain about 1 weight % to about 5 weight % of abinder and about 10 weight % to about 50 weight % of a solvent, forexample.

As occasion demands, the dielectric paste may contain additives selectedfrom among various dispersing agents, plasticizing agents, dielectricmaterials, accessory ingredient compounds, glass frits, insulatingmaterials and the like. In the case of adding these additives to thedielectric paste, it is preferable to set the total content to be equalto or less than about 10 weight %. In the case where a butyral systemresin is employed as the binder resin, it is preferable to set thecontent of the plasticizing agent to be about 25 weight parts to about100 weight parts with respect to 100 weight parts of the binder. Whenthe content of the plasticizing agent is too small, the ceramic greensheet tends to become brittle and on the other hand, when the content ofthe plasticizing agent is too large, the plasticizing agent oozes outand the ceramic green sheet becomes hard to handle.

In the present invention, a ceramic green sheet is fabricated byapplying the dielectric paste onto a first support sheet to form acoating layer and drying the coating layer.

The dielectric paste is applied onto the first support sheet using anextrusion coater or wire bar coater, thereby forming a coating layer.

As the first support sheet, a polyethylene terephthalate is employed,for example, and the surface of the first support sheet is coated with asilicon resin, an alkyd resin or the like in order to improve thereleasability thereof. The thickness of the first support sheet is notparticularly limited but it is preferable for the first support sheet tohave a thickness of about 5 μm to about 100 μm.

The thus formed coating layer is dried at a temperature of about 50° C.to about 100° C. for about 1 to about 20 minutes, whereby a ceramicgreen sheet is formed on the first support sheet.

In the present invention, the thickness of the ceramic green sheet afterdrying is preferably equal to or thinner than 3 μm and more preferablyequal to or thinner than 1.5 μm.

In the present invention, when an electrode layer of a multi-layeredunit is to be formed, a second support sheet is prepared independentlyof the first support sheet and the second support sheet is coated withan electrode paste using a screen printing machine or a gravure printingmachine, thereby forming an electrode layer.

As the second support sheet, a polyethylene terephthalate is employed,for example, and the surface of the second support sheet is coated witha silicon resin, an alkyd resin or the like in order to improve thereleasability thereof. The thickness of the second support sheet is notparticularly limited and may be the same as or different from that ofthe first support sheet on which the ceramic green sheet is formed butit is preferable for the second support sheet to have a thickness ofabout 5 μm to about 100 μm.

In the present invention, prior to forming an electrode layer on thesecond support sheet, a dielectric paste is first prepared and appliedonto the second support sheet, whereby a release layer is formed on thesecond support sheet.

The dielectric paste for forming the release layer preferably containsdielectric particles having the same composition as that of dielectricparticles contained in the ceramic green sheet.

The dielectric paste for forming the release layer contains, in additionto the dielectric particles, a binder, and, optionally, a plasticizingagent and a release agent. The size of the dielectric particles may bethe same as that of the dielectric particles contained in the ceramicgreen sheet but is preferably smaller than that of the dielectricparticles contained in the ceramic green sheet.

Illustrative examples of binders usable for forming the release layerinclude acrylic resin, polyvinyl butyral, polyvinyl acetal, polyvinylalcohol, polyolefin, polyurethane, polystyrene, copolymer thereof, andemulsion thereof.

The binder contained in the dielectric paste for forming the releaselayer may or may not belong to the same binder group as that the bindercontained in the ceramic green sheet belongs to but it preferablybelongs to the same binder group as that the binder contained in theceramic green sheet belongs to.

The binder contained in dielectric paste for forming the release layercontains the binder preferably in an amount of about 2.5 weight % toabout 200 weight % with respect to 100 weight parts of the dielectricparticles, more preferably in an amount of about 5 weight parts to about30 weight parts, most preferably in an amount of about 8 weight parts toabout 30 weight parts.

The plasticizing agent contained in the dielectric paste for forming therelease layer is not particularly limited and illustrative examplesthereof include phthalate ester, adipic acid, phosphate ester, glycolsand the like. The plasticizing agent contained in the dielectric pastefor forming the release layer may or may not belong to the sameplasticizing agent group as that the plasticizing agent contained in theceramic green sheet belongs to.

The dielectric paste for forming the release layer contains theplasticizing agent preferably in an amount of about 0 weight % to about200 weight % with respect to 100 weight parts of the binder, morepreferably in an amount of about 20 weight parts to about 200 weightparts, most preferably in an amount of about 50 weight parts to about100 weight parts.

The releasing agent contained in the dielectric paste for forming therelease layer is not particularly limited and illustrative examplesthereof include paraffin, wax, silicone oil and the like.

The dielectric paste for forming the release layer contains thereleasing agent preferably in an amount of about 0 weight % to about 100weight % with respect to 100 weight parts of the binder, more preferablyin an amount of about 2 weight parts to about 50 weight parts, mostpreferably in an amount of about 5 weight parts to about 20 weightparts.

In the present invention, it is preferable for the content ratio of thebinder to the dielectric material contained in the release layer to besubstantially equal to or lower than the content ratio of the binder tothe dielectric material contained in the ceramic green sheet. Further,it is preferable for the content ratio of the plasticizing agent to thedielectric material contained in the release layer to be substantiallyequal to or higher than the content ratio of the plasticizing agent tothe dielectric material contained in the ceramic green sheet. Moreover,it is preferable for the content ratio of the releasing agent to thedielectric material contained in the release layer to be higher than thecontent ratio of the releasing agent to the dielectric materialcontained in the ceramic green sheet.

In the case where the release layer having the above describedcomposition is formed, even if the ceramic green sheet is very thin, thestrength of the release layer can be lower than the breaking strength ofthe ceramic green sheet and it is therefore possible to reliably preventthe ceramic green sheet from being destroyed when the second supportsheet is peeled off from the release layer.

The release layer is formed by applying the dielectric paste onto thesecond support sheet using a wire bar coater or the like.

The thickness of the release layer is preferably equal to or thinnerthan that of an electrode layer to be formed thereon, more preferablyequal to or thinner than about 60% of the electrode layer thickness andmost preferably equal to or thinner than about 30% of the electrodelayer thickness.

After the release layer has been formed, it is dried at a temperature ofabout 50° C. to about 100° C. for about 1 to about 10 minutes.

After the release layer has been dried, an electrode layer which willform an inner electrode layer after baking is formed on the surface ofthe release layer in a predetermined pattern.

In the present invention, the electrode paste usable for forming theelectrode layer is prepared by kneading a conductive material containingany of various conductive metals or alloys, any of various oxides whichwill form a conductive material containing any of various conductivemetals or alloys after baking, an organic metal compound, resinate orthe like, and an organic vehicle prepared by dissolving a binder in anorganic solvent.

As the conductive material used for preparing the electrode paste, Ni,Ni alloy or the mixture thereof is preferably used. The shape of theconductive material is not particularly limited. The conductive materialparticles may have a spherical shape or a scale-like shape, or theconductive material may contain spherical conductive material particlesand scale-like conductive material particles. The average particlediameter of the conductive material is not particularly limited but aconductive material having an average particle diameter of about 0.1 μmto about 2 μm is normally used for preparing the electrode paste and theconductive material having an average particle diameter of about 0.2 μmto about 1 μm is preferably used for preparing the electrode paste.

The binder for preparing the organic vehicle is not particularlylimited, ethylcellulose, acrylic resin, polyvinyl butyral, polyvinylacetal, polyvinyl alcohol, polyolefin, polyurethane, polystyrene and thecopolymer thereof can be used for preparing the organic vehicle andamong these, a butyral system such as polyvinyl butyral is particularlypreferable for preparing the organic vehicle.

The electrode paste preferably contains the binder in an amount about2.5 weight parts to about 20 weight parts with respect to 100 weightparts of the conductive material.

As the solvent, a known solvent such as terpineol, butyl carbitol,kerosene can be used. The content of the solvent is preferably about 20weight % to about 55 weight % with respect to the weight of theelectrode paste.

In order to improve adhesion property, it is preferable for theelectrode paste to contain a plasticizing agent.

The plasticizing agent contained in the electrode paste is notparticularly limited and illustrative examples thereof include phthalateester such as benzyl butyl phthalate (BBP), adipic acid, phosphateester, glycols and the like. The electrode paste contains theplasticizing agent preferably in an amount of about 10 weight % to about300 weight % with respect to 100 weight parts of the binder, morepreferably in an amount of about 10 weight parts to about 200 weightparts.

In the case where the amount of the plasticizing agent added to theelectrode paste is too large, the strength of the electrode layer tendsto be markedly lower.

The electrode layer is formed by printing the surface of the releaselayer formed on the second support sheet with the electrode paste usinga screen printing machine or a gravure printing machine.

It is preferable to form the electrode layer so as to have a thicknessof about 0.1 μm to about 5 μm and it is more preferable to form theelectrode layer so as to have a thickness of about 0.1 μm to about 1.5μm.

In the present invention, it is preferable to further print a dielectricpaste on the surface of the release layer formed on the second supportsheet where no electrode layer is formed using a screen printing machineor a gravure printing machine in a complementary pattern to that of theelectrode layer, thereby forming a spacer layer.

It is possible to form the spacer layer on the surface of the releaselayer formed on the second support sheet in a complementary pattern tothat of the electrode layer prior to forming the electrode layer.

In the present invention, the dielectric paste used for forming thespacer layer is prepared in a similar manner to that for preparing thedielectric paste for the ceramic green sheet.

The dielectric paste used for forming the spacer layer preferablycontains dielectric particles having the same composition as that of thedielectric particles contained in the ceramic green sheet.

The dielectric paste used for forming the spacer layer preferablycontains, in addition to the dielectric particles, a binder, and,optionally, a plasticizing agent and a release agent. The size of thedielectric particles may be the same as that of the dielectric particlescontained in the ceramic green sheet but is preferably smaller than thatof the dielectric particles contained in the ceramic green sheet.

Illustrative examples of binders usable for forming the spacer layerinclude acrylic resin, polyvinyl butyral, polyvinyl acetal, polyvinylalcohol, polyolefin, polyurethane, polystyrene, copolymer thereof, andemulsion thereof.

The binder contained in dielectric paste for forming the spacer layermay or may not belong to the same binder group as that the bindercontained in the ceramic green sheet belongs to but it preferablybelongs to the same binder group as that the binder contained in theceramic green sheet belongs to.

The binder contained in dielectric paste for forming the spacer layercontains the binder preferably in an amount of about 2.5 weight % toabout 200 weight % with respect to 100 weight parts of the dielectricparticles, more preferably in an amount of about 4 weight parts to about15 weight parts, most preferably in an amount of about 6 weight parts toabout 10 weight parts.

The plasticizing agent contained in the dielectric paste for forming thespacer layer is not particularly limited and illustrative examplesthereof include phthalate ester, adipic acid, phosphate ester, glycolsand the like. The plasticizing agent contained in the dielectric pastefor forming the release layer may or may not belong to the sameplasticizing agent group as that the plasticizing agent contained in theceramic green sheet belongs to.

The dielectric paste for forming the spacer layer contains theplasticizing agent preferably in an amount of about 0 weight % to about200 weight % with respect to 100 weight parts of the binder, morepreferably in an amount of about 20 weight parts to about 200 weightparts, most preferably in an amount of about 50 weight parts to about100 weight parts.

The releasing agent contained in the dielectric paste for forming thespacer layer is not particularly limited and illustrative examplesthereof include paraffin, wax, silicone oil and the like.

The dielectric paste for forming the spacer layer contains the releasingagent preferably in an amount of about 0 weight % to about 100 weight %with respect to 100 weight parts of the binder, more preferably in anamount of about 2 weight parts to about 50 weight parts, most preferablyin an amount of about 5 weight parts to about 20 weight parts.

In the present invention, it is preferable to form the electrode layerand the spacer layer so that t_(s)/t_(e) is equal to or larger than 0.7and equal to or smaller than 1.2, where t_(s) is the thickness of thespacer layer and t_(e) is the thickness of the electrode layer. It ismore preferable to form them so that t_(s)/t_(e) is equal to or largerthan 0.8 and equal to or smaller than 1.2 and it is most preferable toform them so that t_(s)/t_(e) is equal to or larger than 0.9 and equalto or smaller than 1.2.

The electrode layer and the spacer layer are dried at a temperature ofabout 70° C. to about 120° C. for about 5 to about 15 minutes. Thedrying conditions of the electrode layer and the spacer layer are notparticularly limited.

The ceramic green sheet, and the electrode layer and the spacer layerare bonded via an adhesive layer and a third support sheet is preparedin order to form an adhesive layer.

As the third support sheet, a polyethylene terephthalate is employed,for example, and the surface of the third support sheet is coated with asilicon resin, an alkyd resin or the like in order to improve thereleasability thereof. The thickness of the third support sheet is notparticularly limited but it is preferable for the third support sheet tohave a thickness of about 5 μm to about 100 μm.

The adhesive layer is formed by coating the third support sheet with anadhesive agent solution.

In the present invention, the adhesive agent solution contains a binder,and, optionally, a plasticizing agent, a release agent and an antistaticagent.

The adhesive agent solution may contain dielectric particles having thesame composition as that of dielectric particles contained in theceramic green sheet. In the case where the adhesive agent solutioncontains dielectric particles, it is preferable for the ratio of theweight of the dielectric particles to the weight of the binder to beless than the ratio of the weight of the dielectric particles containedin the ceramic green sheet to the weight of the binder.

The binder contained in the adhesive agent solution preferably belongsto the same binder group as that the binder contained in the ceramicgreen sheet belongs to but it is not absolutely necessary for it tobelong to the same binder group as that the binder contained in theceramic green sheet belongs to.

The plasticizing agent contained in the adhesive agent solutionpreferably belongs to the same plasticizing agent group as that theplasticizing agent contained in the dielectric paste for forming theceramic green sheet belongs to but it is not absolutely necessary for itto belong to the same plasticizing agent group as that the plasticizingagent contained in the dielectric paste for forming the ceramic greensheet belongs to.

The content of the plasticizing agent is preferably about 0 weight % toabout 200 weight % with respect to 100 weight parts of the binder, morepreferably about 20 weight parts to about 200 weight parts, and mostpreferably about 50 weight parts to about 100 weight parts.

In the present invention, the adhesive agent solution preferablycontains an antistatic agent in an amount of 0.01 weight % to 15 weight% of the binder and more preferably contains an antistatic agent in anamount of 0.01 weight % to 10 weight % of the binder.

In the present invention, the antistatic agent contained in the adhesiveagent solution is not particularly limited insofar as it is an organicsolvent having a hygroscopic property and illustrative examples of theantistatic agent contained in the adhesive agent solution includeethylene glycol, polyethylene glycol, 2-3 butanediol, glycerin, anampholytic surfactant such as an imidazoline system surfactant, apolyalkylene glycol derivative system surfactant and a carboxylic acidamidine salt system surfactant, and the like.

Among these, an ampholytic surfactant such as an imidazoline systemsurfactant, a polyalkylene glycol derivative system surfactant or acarboxylic acid amidine salt system surfactant is preferable since asmall amount thereof can prevent static charge from being generated andenable peel-off of the third support sheet from the adhesive layer witha small releasing force, and an imidazoline system surfactant isparticularly preferable since it enables peel-off the third supportsheet from the adhesive layer with a very small releasing force.

The adhesive agent solution is applied onto the third support sheetusing a bar coater, an extrusion coater, a reverse coater, a dip coater,a kiss coater or the like, thereby forming the adhesive layer so as topreferably have a thickness of about 0.02 μm to about 0.3 μm, morepreferably have a thickness of about 0.02 μm to about 0.1 μm. In thecase where the thickness of the adhesive layer is thinner than about0.02 μm, the adhesion force is lowered and on the other hand, in thecase where the thickness of the adhesive layer exceeds about 0.3 μm,defects (empty spaces) tend to be generated.

The adhesive layer is dried at a temperature between room temperature(25° C.) and about 80° C. for about 1 to about 5 minutes, for example.The drying conditions of the adhesive layer are not particularlylimited.

The adhesive layer formed on the third support sheet is transferred ontothe surfaces of the electrode layer and the spacer layer formed on thesecond support sheet.

When the adhesive layer is to be transferred, it is kept in contact withthe surfaces of the electrode layer and the spacer layer formed on thesecond support sheet, and the adhesive layer, the electrode layer andspacer layer are pressed at a temperature of about 40° C. to about 100°C. under a pressure of about 0.2 MPa to about 15 MPa, preferably under apressure of 0.2 MPa to about 6 MPa, whereby the adhesive layer is bondedonto the surface of the electrode layer and the spacer layer. Afterward,the third support sheet is peeled off from the adhesive layer.

When the adhesive layer is to be transferred onto the electrode layerand the spacer layer, the second support sheet formed with the electrodelayer and the spacer layer and the third support sheet formed with theadhesive layer may be pressed onto each other using a pressing machineor using a pair of pressure rollers but it is preferable to press thesecond support sheet and the third support sheet onto each other using apair of pressure rollers.

Then, the ceramic green sheet and the electrode and spacer layers arebonded to each other via the adhesive layer.

The ceramic green sheet and the electrode and spacer layers are pressedat a temperature of about 40° C. to about 100° C. under a pressure ofabout 0.2 MPa to about 15 MPa, preferably under a pressure of 0.2 MPa toabout 6 MPa, whereby the ceramic green sheet is bonded onto theelectrode layer and spacer layer via the adhesive layer.

Preferably, the ceramic green sheet, the adhesive layer, and theelectrode and spacer layers are pressed onto each other using a pair ofpressure rollers and the ceramic green sheet and the electrode andspacer layers are bonded to each other via the adhesive layer.

When the ceramic green sheet and the electrode and spacer layers havebeen bonded to each other via the adhesive layer, the first supportsheet is peeled off from the ceramic green sheet.

A laminated body is thus obtained and is cut to a predetermined size,thereby fabricating a multi-layered unit including the release layer,the electrode layer, the spacer layer, the adhesive layer and theceramic green sheet laminated on the second support sheet in this order.

A number of the thus fabricated multi-layered units are laminated viathe adhesive layer, thereby fabricating a multi-layered block.

When a number of the multi-layered units are to be laminated, a basesubstrate formed with an agglutinant layer is first set on a substrateformed with a plurality of holes.

In the present invention, the material for forming the base substrate isnot particularly limited but it is preferable to form the base substrateof a plastic material such as polyethylene, polypropylene,polycarbonate, polyphenylene ether and polyethylene terephthalate.

The thickness of the base substrate is not particularly limited insofaras it can support the multi-layered unit.

The base substrate is sucked with air via the plurality of holes formedin the substrate, thereby being fixed at a predetermined position on thesubstrate.

The agglutinant layer is formed by coating the base substrate with anagglutinant agent solution.

In the present invention, the agglutinant agent solution contains abinder and, optionally, a plasticizing agent, a release agent and anantistatic agent.

The agglutinant agent solution may contain dielectric particles havingthe same composition as that of dielectric particles contained in theceramic green sheet. In the case where the agglutinant agent solutioncontains dielectric particles, it is preferable for the ratio of theweight of the dielectric particles to the weight of the binder to beless than the ratio of the weight of the dielectric particles containedin the ceramic green sheet to the weight of the binder.

The binder contained in the agglutinant agent solution preferablybelongs to the same binder group as that the binder contained in theceramic green sheet belongs to but it is not absolutely necessary for itto belong to the same binder group as that the binder contained in theceramic green sheet belongs to.

The plasticizing agent contained in the agglutinant agent solutionpreferably belongs to the same plasticizing agent group as that theplasticizing agent contained in the dielectric paste for forming theceramic green sheet belongs to but it is not absolutely necessary for itto belong to the same plasticizing agent group as that the plasticizingagent contained in the dielectric paste for forming the ceramic greensheet belongs to.

The content of the plasticizing agent is preferably about 0 weight % toabout 200 weight % with respect to 100 weight parts of the binder, morepreferably about 20 weight parts to about 200 weight parts, and mostpreferably about 50 weight parts to about 100 weight parts.

In the present invention, the agglutinant agent solution preferablycontains an antistatic agent in an amount of 0.01 weight % to 15 weight% of the binder and more preferably contains an antistatic agent in anamount of 0.01 weight % to 10 weight % of the binder.

In the present invention, the antistatic agent contained in theagglutinant agent solution is not particularly limited insofar as it isan organic solvent having a hygroscopic property and illustrativeexamples of the antistatic agent contained in the agglutinant agentsolution include ethylene glycol, polyethylene glycol, 2-3 butanediol,glycerin, an ampholytic surfactant such as an imidazoline systemsurfactant, a polyalkylene glycol derivative system surfactant and acarboxylic acid amidine salt system surfactant, and the like.

Among these, an ampholytic surfactant such as an imidazoline systemsurfactant, a polyalkylene glycol derivative system surfactant and acarboxylic acid amidine salt system surfactant is preferable since asmall amount thereof can prevent static charge from being generated andenable peel-off of the third support sheet from the agglutinant layerwith a small releasing force and an imidazoline system surfactant isparticularly preferable since it enables peel-off of the third supportsheet from the agglutinant layer with a very small releasing force.

In the present invention, the agglutinant layer is formed on the basesubstrate so that the bonding strength between the agglutinant layer andthe base substrate is higher than the bonding strength between thesecond support sheet and the release layer of the multi-layered unit andlower than the bonding strength between the agglutinant layer and theceramic green sheet of the multi-layered unit.

In the present invention, the release layer is preferably formed on thesurface of the second support sheet so that the bonding strength betweenthe second support sheet and the release layer of the multi-layered unitis 5 to 20 mN/cm and the agglutinant layer is preferably formed on thesurface of the base substrate so that the bonding strength between theagglutinant layer and the base substrate is 20 to 350 mN/cm and that thebonding strength between the agglutinant layer and the ceramic greensheet of the multi-layered unit is equal to or higher than 350 mN/cm.

In the present invention, the agglutinant layer is preferably formed onthe base substrate so as to have a thickness of 0.01 μm to 0.3 μm. Inthe case where the thickness of the agglutinant layer is thinner than0.01 μm, the bonding strength between the base substrate and the ceramicgreen sheet of the multi-layered unit becomes too low and it becomesdifficult to laminate multi-layered units. On the other hand, in thecase where the thickness of the agglutinant layer exceeds 0.3 μm, when aceramic green chip fabricated by laminating the multi-layered units isbaked, empty spaces are produced in the agglutinant layer andelectrostatic capacitance of a multi-layered ceramic electroniccomponent becomes lower.

The agglutinant layer is dried at a temperature between room temperature(25° C.) and about 80° C. for about 1 to about 5 minutes, for example.The drying conditions of the agglutinant layer are not particularlylimited.

When multi-layered units are to be laminated, the surface of the ceramicgreen sheet of the multi-layered unit is brought into contact with thesurface of the agglutinant layer formed on the surface of the basesubstrate to form a laminated body and the laminated body is pressed,whereby the multi-layered unit is bonded onto the surface of theagglutinant layer.

When the multi-layered unit has been bonded onto the surface of theagglutinant layer and laminated thereon, the second support sheet ispeeled off from the release layer of the multi-layered unit.

Here, since the agglutinant layer is formed on the base substrate sothat the bonding strength between the agglutinant layer and the basesubstrate is higher than the bonding strength between the second supportsheet and the release layer of the multi-layered unit and lower than thebonding strength between the agglutinant layer and the ceramic greensheet of the multi-layered unit, only the second support sheet can beeasily peeled off from the release layer.

When the second support sheet has been peeled off from the multi-layeredunit laminated on the base substrate, a new multi-layered unit isfurther laminated on the multi-layered unit laminated on the basesubstrate.

When a new multi-layered unit is to be further laminated on themulti-layered unit laminated on the base substrate, similarly to thecase where the adhesive layer formed on the third support sheet istransferred onto the surface of the electrode layer, an adhesive layeris first formed on the third support sheet and the adhesive layer istransferred onto the surface of the ceramic green sheet of the newmulti-layered unit to be laminated.

Then, the multi-layered unit is positioned so that the surface of theadhesive layer transferred onto the surface of the ceramic green sheetcomes into contact with the surface of the release layer of themulti-layered unit laminated on the agglutinant layer of the basesubstrate to form a laminated body and the laminated body is pressed,whereby the new multi-layered unit is laminated on the multi-layeredunit laminated on the agglutinant layer of the base substrate.

The second support sheet of the newly laminated multi-layered unit isthen peeled off from the release layer.

Similarly to the above, a predetermined number of the multi-layeredunits are laminated on the agglutinant layer of the base substrate,thereby fabricating a multi-layered block.

Thus, when a predetermined number of multi-layered blocks to be includedin a multi-layered ceramic electronic component have been fabricated,the multi-layered blocks are laminated on a substrate such as the outerlayer of a multi-layered ceramic capacitor.

The multi-layered block laminated on the base substrate is positioned sothat the surface of the release layer of the multi-layered unit lastlaminated on the multi-layered block comes into contact with theadhesive layer formed on the outer layer of a multi-layered ceramiccapacitor or the like to form a laminated body and the laminated body ispressed, thereby laminating the multi-layered block on the substratesuch as the outer layer of a multi-layered ceramic capacitor.

When the multi-layered block has been laminated on the substrate such asthe outer layer of a multi-layered ceramic capacitor, the base substrateis peeled off from the multi-layered block.

Here, since the agglutinant layer is formed on the base substrate sothat the bonding strength between the agglutinant layer and the basesubstrate is higher than the bonding strength between the second supportsheet and the release layer of the multi-layered unit and lower than thebonding strength between the agglutinant layer and the ceramic greensheet of the multi-layered unit, the base substrate can alone be easilypeeled off from the multi-layered block.

When the base substrate has been peeled off from the multi-layered blocklaminated on the substrate such as an outer layer of a multi-layeredceramic capacitor, a new multi-layered block laminated on the basesubstrate is further laminated on the multi-layered block laminated onthe substrate such as the outer layer of a multi-layered ceramiccapacitor.

Here, when the base substrate was peeled off from the multi-layeredblock, since only the base substrate was peeled off and the agglutinantlayer was left on the multi-layered block, when a new multi-layeredblock laminated on the base substrate is to be further laminated on themulti-layered block laminated on the substrate such as the outer layerof a multi-layered ceramic capacitor, it is unnecessary to form anadhesive layer and it is therefore possible to efficiently laminate themulti-layered blocks.

When a new multi-layered block is to be laminated, the new multi-layeredblock laminated on the base substrate is positioned so that the surfaceof the release layer of the multi-layered unit last laminated on themulti-layered block comes into contact with the agglutinant layer of themulti-layered block laminated on the outer layer of a multi-layeredceramic capacitor or the like to form a laminated body and the laminatedbody is pressed, thereby laminating the new multi-layered block on themulti-layered block laminated on the substrate such as the outer layerof a multi-layered ceramic capacitor.

Similarly to the above, multi-layered blocks are laminated and apredetermined number of the multi-layered blocks to be included in themulti-layered ceramic electronic component are laminated.

The above and other objects and features of the present invention willbecome apparent from the following description made with reference tothe accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic partial cross-sectional view showing how a ceramicgreen sheet is formed on a first support sheet.

FIG. 2 is a schematic partial cross-sectional view showing a secondsupport sheet formed with a release layer and an electrode layer on thesurface thereof.

FIG. 3 is a schematic partial cross-sectional view showing how anelectrode layer and a spacer layer are formed on the surface of arelease layer.

FIG. 4 is a schematic partial cross-sectional view showing an adhesivelayer sheet obtained by forming an adhesive layer on the surface of athird support sheet.

FIG. 5 is a schematic cross-sectional view showing a preferredembodiment of an adhering and peeling apparatus for bonding an adhesivelayer formed on a third support sheet onto the surfaces of an electrodelayer and a spacer layer formed on a second support sheet and peelingoff the third support sheet from the adhesive layer.

FIG. 6 is a schematic cross-sectional view showing a preferredembodiment of an adhering apparatus for bonding an electrode layer and aspacer layer onto the surface of a ceramic green sheet via an adhesivelayer.

FIG. 7 is a schematic cross-sectional view showing a multi-layered unitobtained by laminating an electrode layer, a spacer layer, an adhesivelayer and a ceramic green sheet on a second support sheet.

FIG. 8 is a schematic partial cross-sectional view showing a first stepof a lamination process of multi-layered units.

FIG. 9 is a schematic partial cross-sectional view showing a second stepof a lamination process of multi-layered units.

FIG. 10 is a schematic partial cross-sectional view showing a third stepof a lamination process of multi-layered units.

FIG. 11 is a schematic partial cross-sectional view showing a fourthstep of a lamination process of multi-layered units.

FIG. 12 is a schematic partial cross-sectional view showing a fifth stepof a lamination process of multi-layered units.

FIG. 13 is a schematic partial cross-sectional view showing a first stepof a lamination process of for laminating a multi-layered blocklaminated on a base substrate fixed to a substrate on an outer layer ofa multi-layered ceramic capacitor.

FIG. 14 is a schematic partial cross-sectional view showing a secondstep of a lamination process of for laminating a multi-layered blocklaminated on a base substrate fixed to a substrate on an outer layer ofa multi-layered ceramic capacitor.

FIG. 15 is a schematic partial cross-sectional view showing a third stepof a lamination process of for laminating a multi-layered blocklaminated on a base substrate fixed to a substrate on an outer layer ofa multi-layered ceramic capacitor.

FIG. 16 is a schematic partial cross-sectional view showing a fourthstep of a lamination process of for laminating a multi-layered blocklaminated on a base substrate fixed to a substrate on an outer layer ofa multi-layered ceramic capacitor.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

A method for manufacturing a multi-layered ceramic capacitor which is apreferred embodiment of the present invention will now be described withreference to accompanying drawings.

When a multi-layered ceramic capacitor is to be manufactured, adielectric paste is first prepared in order to fabricate a ceramic greensheet.

The dielectric paste is normally prepared by kneading a dielectric rawmaterial and an organic vehicle obtained by dissolving a binder into anorganic solvent.

The resultant dielectric paste is applied onto a first support sheetusing an extrusion coater or wire bar coater, thereby forming a coatinglayer.

As the first support sheet, a polyethylene terephthalate sheet isemployed, for example, and the surface of the first support sheet iscoated with a silicon resin, an alkyd resin or the like in order toimprove the releasability thereof. The thickness of the first supportsheet is not particularly limited but it is preferable for the firstsupport sheet to have a thickness of about 5 μm to about 100 μm.

The thus formed coating layer is dried at a temperature of about 50° C.to about 100° C. for about 1 to about 20 minutes, whereby a ceramicgreen sheet is formed on the first support sheet.

The thickness of the ceramic green sheet after drying is preferablyequal to or thinner than 3 μm and more preferably equal to or thinnerthan 1.5 μm.

FIG. 1 is a schematic partial cross-sectional view showing how theceramic green sheet is formed on the first support sheet.

Actually, the first support sheet 1 is long and the ceramic green sheet2 is continuously formed on the long first support sheet 1.

On other hand, a second support sheet is prepared independently of thefirst support sheet 1 and a release layer and an electrode layer areformed on the second support sheet.

FIG. 2 is a schematic partial cross-sectional view showing a secondsupport sheet 4 formed with a release layer 5 and an electrode layer 6on the surface thereof.

Actually, the second support sheet 4 is long and the release layer 5 iscontinuously formed on the surface of the second support sheet 4 and theelectrode layer 6 is formed on the surface of the release layer 5 in apredetermined pattern.

When the release layer 5 is to be formed on surface of the secondsupport sheet 4, a dielectric paste for forming the release layer 5 isprepared in a similar manner to that for forming the ceramic green sheet2.

A dielectric paste for forming the release layer 5 preferably containsdielectric particles having the same composition as that of dielectricparticles contained in the ceramic green sheet 2.

The binder contained in the dielectric paste for forming the releaselayer 5 may or may not belong to the same binder group as that thebinder contained in the ceramic green sheet 2 belongs to but itpreferably belongs to the same binder group as that the binder containedin the ceramic green sheet 2 belongs to.

When the dielectric paste has been prepared in this manner, the surfaceof the second support sheet 4 is coated with the dielectric paste usinga wire bar coater (not shown), thereby forming the release layer 5.

The thickness of the release layer 5 is preferably equal to or thinnerthan that of an electrode layer 6 to be formed thereon, more preferablyequal to or thinner than about 60% of the electrode layer thickness andmost preferably equal to or thinner than about 30% of the electrodelayer thickness.

As the second support sheet 4, a polyethylene terephthalate sheet isemployed, for example, and the surface of the second support sheet iscoated with a silicon resin, an alkyd resin or the like in order toimprove the releasability thereof. The thickness of the second supportsheet 4 is not particularly limited and may be the same as or differentfrom that of the first support sheet 1 on which the ceramic green sheet2 is formed but it is preferable for the second support sheet 4 to havea thickness of about 5 μm to about 100 μm.

After the release layer 5 has been formed, the release layer 5 is driedat a temperature of about 50° C. to about 100° C. for about 1 to about10 minutes.

In this embodiment, the release layer 5 is formed on the surface of thesecond support sheet 4 so that the bonding strength between the secondsupport sheet 4 and the release layer 5 is 5 to 20 mN/cm.

After the release layer 5 has been dried, an electrode layer 6 whichwill form an inner electrode layer after baking is formed on the surfaceof the release layer 5 in a predetermined pattern.

It is preferable to form the electrode layer 6 so as to have a thicknessof about 0.1 μm to about 5 μm and it is more preferable to form theelectrode layer so as to have a thickness of about 0.1 μm to about 1.5μm.

When the electrode layer 6 is to be formed on the release layer 5, anelectrode paste is first prepared by kneading a conductive materialcontaining any of various conductive metals or alloys, any of variousoxides which will form a conductive material containing any of variousconductive metals or alloys after baking, an organic metal compound,resinate or the like, and an organic vehicle prepared by dissolving abinder in an organic solvent.

As the conductive material used for preparing the electrode paste, Ni,Ni alloy or a mixture thereof is preferably used.

The average particle diameter of the conductive material is notparticularly limited but a conductive material having an averageparticle diameter of about 0.1 μm to about 2 μm is normally used forpreparing the electrode paste and a conductive material having anaverage particle diameter of about 0.2 μm to about 1 μm is preferablyused for preparing the electrode paste.

The electrode layer 6 is formed by printing the surface of the releaselayer formed on the second support sheet with the electrode paste onusing a screen printing machine or a gravure printing machine.

After forming the electrode layer 6 having the predetermined pattern onthe surface of the release layer 5 using a screen printing process or agravure printing process, a spacer layer is formed on the surface of therelease layer 5 where no electrode layer 6 is formed in a complementarypattern to that of the electrode layer 6.

FIG. 3 is a schematic partial cross-sectional view showing how theelectrode layer 6 and the spacer layer 7 are formed on the surface ofthe release layer 5.

The spacer layer 7 can be formed on regions of the release layer 5 otherthan regions where the electrode layer 6 will be formed prior to formingthe electrode layer 6 on the surface of the release layer 5.

When the spacer layer 7 is to be formed, a dielectric paste having asimilar composition to that of the dielectric paste used for forming theceramic green sheet is prepared and a screen printing process or agravure printing process is used to print the dielectric paste on thesurface of the release layer 5 where no electrode layer 6 is formed in acomplementary pattern to that of the electrode layer 6.

In this embodiment, the spacer layer 7 is formed on the release layer 5so that t_(s)/t_(e) is equal to 1.1, where t_(s) is the thickness of thespacer layer 7 and t_(e) is the thickness of the electrode layer 6.

In this embodiment, the ceramic green sheet 2, and the electrode layer 6and the spacer layer 7 are bonded via an adhesive layer and a thirdsupport sheet is further prepared independently of the first supportsheet 1 on which the ceramic green sheet 2 is formed and the secondsupport sheet 4 on which the electrode layer 6 and the spacer layer 7are formed and an adhesive layer is formed on the third support sheet,thereby fabricating an adhesive layer sheet.

FIG. 4 is a schematic partial cross-sectional view showing the adhesivelayer sheet 11 in which an adhesive layer 10 is formed on the surface ofa third support sheet 9.

Actually, the third support sheet 9 is long and the adhesive layer 10 iscontinuously formed on the long third support sheet 9.

As the third support sheet 9, a polyethylene terephthalate sheet isemployed, for example, and the surface of the third support sheet 9 iscoated with a silicon resin, an alkyd resin or the like in order toimprove the releasability thereof. The thickness of the third supportsheet 9 is not particularly limited but it is preferable for the thirdsupport sheet 9 to have a thickness of about 5 μm to about 100 μm.

When the adhesive layer 10 is to be formed, an adhesive agent solutionis first prepared.

In this embodiment, the adhesive agent solution contains a binder, and,optionally, a plasticizing agent, a release agent and an antistaticagent.

The adhesive agent solution may contain dielectric particles having thesame composition as that of dielectric particles contained in theceramic green sheet. In the case where the adhesive agent solutioncontains dielectric particles, it is preferable for the ratio of theweight of the dielectric particles to the weight of the binder to beless than the ratio of the weight of the dielectric particles containedin the ceramic green sheet to the weight of the binder.

The binder contained in the adhesive agent solution preferably belongsto the same binder group as that the binder contained in the ceramicgreen sheet belongs to but it is not absolutely necessary for it tobelong to the same binder group as that the binder contained in theceramic green sheet belongs to.

The plasticizing agent contained in the adhesive agent solutionpreferably belongs to the same plasticizing agent group as that theplasticizing agent contained in the dielectric paste for forming theceramic green sheet belongs to but it is not absolutely necessary for itto belong to the same plasticizing agent group as that the plasticizingagent contained in the dielectric paste for forming the ceramic greensheet belongs to.

The content of the plasticizing agent is preferably about 0 weight % toabout 200 weight % with respect to 100 weight parts of the binder, morepreferably about 20 weight parts to about 200 weight parts, and mostpreferably about 50 weight parts to about 100 weight parts.

In this embodiment, the adhesive agent solution contains an antistaticagent in an amount of 0.01 weight % to 15 weight % of the binder.

In this embodiment, as the antistatic agent, an imidazoline systemsurfactant is employed.

The thus prepared adhesive agent solution is applied onto the thirdsupport sheet 9 using a bar coater, an extrusion coater, a reversecoater, a dip coater, a kiss coater or the like, thereby forming theadhesive layer 10 so as to preferably have a thickness of about 0.02 μmto about 0.3 μm, more preferably have a thickness of about 0.02 μm toabout 0.1 μm. In the case where the thickness of the adhesive layer 10is thinner than about 0.02 μm, the adhesion force is lowered and, on theother hand, in the case where the thickness of the adhesive layer 10exceeds about 0.3 μm, defects (empty spaces) tend to be generated.

The adhesive layer 10 is dried at a temperature between room temperature(25° C.) and about 80° C. for about 1 to about 5 minutes. The dryingconditions of the adhesive layer 10 are not particularly limited.

FIG. 5 is a schematic cross-sectional view showing a preferredembodiment of an adhering and peeling apparatus for bonding the adhesivelayer 10 formed on the third support sheet 9 onto the surfaces of theelectrode layer 6 and the spacer layer 7 formed on the second supportsheet 4 and peeling off the third support sheet 9 from the adhesivelayer 10.

As shown in FIG. 5, the adhering and peeling apparatus according to thisembodiment includes a pair of pressure rollers 15, 16 whose temperatureis held at about 40° C. to about 100° C.

As shown in FIG. 5, the third support sheet 9 formed with the adhesivelayer 10 is fed to a portion between the pair of pressure rollers 15, 16from an obliquely upper location in such a manner that the third supportsheet 9 is wound around part of the upper pressure roller 15 by atensile force applied to the third support sheet 9. On the other hand,the second support sheet 4 formed with the electrode layer 6 and thespacer layer 7 is fed to a portion between the pair of pressure rollers15, 16 in a substantially horizontal direction in such a manner that thesecond support sheet 4 comes into contact with the lower pressure roller16 and the electrode layer 6 and the spacer layer 7 come into contactwith the adhesive layer 10 formed on the third support sheet 9.

The feed rates of the second support sheet 4 and the third support sheet9 are set to 2 m/sec, for example, and the nip pressure between the pairof pressure rollers 15, 16 is preferably set between about 0.2 MPa andabout 15 MPa and more preferably between about 0.2 Mpa and about 6 Mpa.

As a result, the adhesive layer 10 formed on the third support sheet 9is bonded to the surfaces of the electrode layer 6 and the spacer layer7 formed on the second support sheet 4.

As shown in FIG. 5, the third support sheet 9 formed with the adhesivelayer 10 is fed obliquely upward from the portion between the pair ofpressure rollers 15, 16 and the third support sheet 9 is peeled off fromthe adhesive layer 10 bonded to the electrode layer 6 and the spacerlayer 7.

When the third support sheet 9 is peeled off from the adhesive layer 10,if static charge should be generated so that dust attaches to theadhesive layer 10 and the adhesive layer 10 is attracted to thirdsupport sheet 9, it would become difficult to peel off the third supportsheet 9 from the adhesive layer 10. However, in this embodiment, theadhesive layer 10 contains an imidazoline system surfactant in an amountof 0.01 weight % to 15 weight % of the binder, so that generation ofstatic charge can be effectively prevented.

When the adhesive layer 10 has been bonded to the surfaces of theelectrode layer 6 and the spacer layer 7 formed on the second supportsheet 4 and the third support sheet 9 has been peeled off from theadhesive layer 10 in this manner, the electrode layer 6 and the spacerlayer 7 are bonded onto the surface of the ceramic green sheet 2 formedon the first support sheet 1 via the adhesive layer 10.

FIG. 6 is a schematic cross-sectional view showing a preferredembodiment of an adhering apparatus for bonding the electrode layer 6and the spacer layer 7 onto the surface of the ceramic green sheet 2 viathe adhesive layer 10.

As shown in FIG. 6, the adhering apparatus according to this embodimentincludes a pair of pressure rollers 17, 18 whose temperature is held atabout 40° C. to about 100° C. The second support sheet 4 formed with theelectrode layer 6, the spacer layer 7 and the adhesive layer 10 is fedto a portion between the pair of pressure rollers 17, 18 in such amanner that the second support sheet 4 comes into contact with the upperpressure roller 17 and, on the other hand, the first support sheet 1formed with the ceramic green sheet 2 is fed to the portion between thepair of pressure rollers 17, 18 in such a manner that the first supportsheet 1 comes into contact with the lower pressure roller 18.

In this embodiment, the pressure roller 17 is constituted as a metalroller and the pressure roller 18 is constituted as a rubber roller.

The feed rates of the first support sheet 1 and the second support sheet4 and are set to 2 m/sec, for example, and the nip pressure between thepair of pressure rollers 15, 16 is preferably set between about 0.2 MPaand about 15 MPa and more preferably between about 0.2 Mpa and about 6Mpa.

In this embodiment, since the ceramic green sheet 2 and the electrodeand spacer layers 6, 7 are bonded to each other via the adhesive layer10 and, unlike in the conventional process, they are not bondedutilizing the agglutinant forces of binders contained in the ceramicgreen sheet 2, the electrode layer 6 and spacer layer 7 or thedeformation of the ceramic green sheet 2, the electrode layer 6 and thespacer layer 7, it is possible to bond the ceramic green sheet 2 and theelectrode and the spacer layers 6, 7 with a low pressure such as about0.2 MPa to about 15 Mpa.

Therefore, since it is possible to prevent the ceramic green sheet 2,the electrode layer 6 and the spacer layer 7 from deforming, amulti-layered ceramic capacitor can be manufactured with high accuracyby laminating the thus formed laminated bodies including the ceramicgreen sheet 2, the electrode layer 6 and the spacer layer 7.

Further, in this embodiment, the electrode layer 6, and the spacer layer7 whose density is lower than that of the electrode layer 6 and whosecompression ratio is higher than that of the electrode layer 6, areformed so that t_(s)/t_(e) is equal to 1.1, the spacer layer 7 iscompressed by the pressure applied when the electrode layer 6 and thespacer layer 7 are transferred onto the ceramic green sheet 2 via theadhesive layer 10, so that the ceramic green sheet 2, and the electrodeand spacer layers 6, 7 can be reliably bonded to each other via theadhesive layer 10. Therefore, it is possible to reliably prevent theelectrode layer 6 from peeling off from the ceramic green sheet 2together with the second support sheet 4 when the second support sheet 4is peeled off.

Furthermore, in this embodiment, since the electrode layer 6 formed onthe second support sheet 4 is bonded onto the surface of the ceramicgreen sheet 2 via the adhesive layer 10 after the electrode layer 6 hasbeen dried, unlike in the case where the electrode layer 6 is formed byprinting an electrode paste on the surface of the ceramic green sheet 2,the electrode paste neither dissolves nor swells the binder contained inthe ceramic green sheet 2 and the electrode paste does not seep into theceramic green sheet 2. It is therefore possible to form the electrodelayer 6 on the surface of the ceramic green sheet 2.

When the ceramic green sheet 2 formed on the first support sheet 1 hasbeen bonded onto the electrode layer 6 and the spacer layer 7 formed onthe second support sheet 4 via the adhesive layer 10 in this manner, thefirst support sheet 1 is peeled off from the ceramic green sheet 2.

Thus, a laminated body in which the release layer 5, the electrode layer6, the spacer layer 7, the adhesive layer 10 and the ceramic green sheet2 are laminated on the second support sheet 4 is obtained.

The thus obtained laminated body is cut to a predetermined size, therebyfabricating a multi-layered unit having a predetermined size andincluding the release layer 5, the electrode layer 6, the spacer layer7, the adhesive layer 10 and the ceramic green sheet 2 laminated on thesecond support sheet 4.

FIG. 7 is a schematic cross-sectional view showing multi-layered unit 20cut to a predetermined size in this manner.

As shown in FIG. 7, the multi-layered unit 20 is formed on the secondsupport sheet 4 and includes the release layer 5, the electrode layer 6,the spacer layer 7, the adhesive layer 10 and the ceramic green sheet 2.

Similarly to the above, release layers 5, electrode layers 6, spacerlayers 7, adhesive layers 10 and ceramic green sheets 2 are laminated onthe surfaces of other second support sheets 4 so as to fabricate anumber of the multi-layered units 20 each including the release layer 5,the electrode layer 6, the spacer layer 7, the adhesive layer 10 and theceramic green sheet 2.

A number of the thus fabricated multi-layered units 20 are laminated viathe adhesive layer 10 transferred onto the surface of the ceramic greensheet 2 of each of the multi-layered units 20, thereby a multi-layeredceramic capacitor is manufactured.

FIG. 8 is a schematic partial cross-sectional view showing a first stepof a lamination process of the multi-layered units 20.

As shown in FIG. 8, when a number of the multi-layered units 20 are tobe laminated, a base substrate 28 formed with an agglutinant layer 27 onthe surface thereof is first set on a substrate 25 formed with a numberof holes 26.

As the base substrate 28, a polyethylene terephthalate film or the likeis employed.

In this embodiment, the agglutinant layer 27 is formed on the basesubstrate 28 so that the bonding strength between the agglutinant layer27 and the base substrate 28 is higher than the bonding strength betweenthe second support sheet 4 and the release layer 5 of the multi-layeredunit 20 and lower than the bonding strength between the agglutinantlayer 27 and the ceramic green sheet 2 of the multi-layered unit 20.

In this embodiment, the agglutinant layer 27 is formed on the basesubstrate 28 so that the bonding strength between the agglutinant layer27 and the base substrate 28 is 20 to 350 mN/cm and that the bondingstrength between the agglutinant layer 27 and the ceramic green sheet 2of the multi-layered unit 20 is equal to or higher than 350 mN/cm.

The agglutinant layer 27 is formed by coating the base substrate 28 withan agglutinant agent solution.

In this embodiment, the agglutinant agent solution contains a binder, aplasticizing agent and an antistatic agent, and, optionally, a releaseagent.

The agglutinant agent solution contains a binder belonging to the samebinder group as that the binder contained in the dielectric paste forforming the ceramic green sheet 2 belongs to and contains a plasticizingagent belonging to the same plasticizing agent group as that theplasticizing agent contained in the dielectric paste for forming theceramic green sheet 2 belongs to.

The agglutinant agent solution contains an imidazoline system surfactantin an amount of 0.01 weight % to 15 weight % of the binder.

In this embodiment, the agglutinant layer 27 has a thickness of 0.01 μmto 0.3 μm. In the case where the thickness of the agglutinant layer 27is thinner than 0.01 μm, the bonding strength between the base substrate28 and the ceramic green sheet 2 of the multi-layered unit 20 becomestoo low and it becomes difficult to laminate multi-layered units 20. Onthe other hand, in the case where the thickness of the agglutinant layer27 exceeds 0.3 μm, when a ceramic green chip fabricated by laminatingthe multi-layered units is baked, empty spaces are produced in theagglutinant layer 27 and electrostatic capacitance of a multi-layeredceramic electronic component becomes lower.

The base substrate 28 is sucked with air via the plurality of holes 26formed in the substrate 25, thereby fixing it at a predeterminedposition on the substrate 25.

FIG. 9 is a schematic partial cross-sectional view showing a second stepof the lamination process of the multi-layered units 20.

As shown in FIG. 9, the multi-layered unit 20 is positioned so that thesurface of the ceramic green sheet 2 comes into contact with the surfaceof the agglutinant layer 27 formed on the base substrate 28 and apressure is applied onto the second support sheet 4 of the multi-layeredunits 20 using a pressing machine or the like.

As a result, the multi-layered unit 20 is bonded onto the base substrate28 fixed on the substrate 25 via the agglutinant layer 27 to belaminated thereon.

FIG. 10 is a schematic partial cross-sectional view showing a third stepof the lamination process of the multi-layered units 20.

When the multi-layered unit 20 has been bonded onto the base substrate28 fixed on the substrate 25 via the agglutinant layer 27 to belaminated thereon, the second support sheet 4 is peeled off from therelease layer 5 of the multi-layered units 20, as shown in FIG. 10.

In this embodiment, the release layer 5 is formed on the surface of thesecond support sheet 4 so that the bonding strength between the secondsupport sheet 4 and the release layer 5 of the multi-layered unit 20 is5 to 20 mN/cm and the agglutinant layer 27 is formed on the surface ofthe base substrate 28 so that the bonding strength between theagglutinant layer 27 and the base substrate 28 is 20 to 350 mN/cm andthat the bonding strength between the agglutinant layer 27 and theceramic green sheet 2 of the multi-layered unit 20 is equal to or higherthan 350 mN/cm. Therefore, since the agglutinant layer 27 is formed onthe surface of the base substrate 28 so that the bonding strengthbetween the agglutinant layer 27 and the base substrate 28 is higherthan the bonding strength between the second support sheet 4 and therelease layer 5 of the multi-layered unit 20 and lower than the bondingstrength between the agglutinant layer 27 and the ceramic green sheet 2of the multi-layered unit 20, it is possible to easily peel off only thesecond support sheet 4 from the multi-layered unit 20 bonded onto theagglutinant layer 27.

Further, in this embodiment, since the electrode layer 6 and the spacerlayer 7 are formed so that t_(s)/t_(e) is equal to 1.1, the spacer layer7 is compressed by the pair of pressure rollers 17, 18, not only thespacer layer 7 but also the electrode layer 6 are bonded onto thesurface of the ceramic green sheet 2 via the adhesive layer 10 and it istherefore possible to effectively prevent the electrode layer 6 frombeing peeled off from the ceramic green sheet 2 together with the secondsupport sheet 4 when the second support sheet 4 is peeled off.

When the second support sheet 4 has been peeled off from the releaselayer 5 of the multi-layered unit 20 in this manner, a new multi-layeredunit 20 is further laminated on the release layer 5 of the multi-layeredunit 20 laminated on the base substrate 28 fixed to the substrate 25 viathe agglutinant layer 27.

Prior to newly laminating the multi-layered unit 20, the adhesive layer10 formed on the third support sheet 9 is transferred onto the surfaceof the ceramic green sheet 2 of the multi-layered unit 20 to be newlylaminated.

More specifically, similarly to the case where the adhesive layer 10 ofthe adhesive layer sheet 11 is transferred onto the surfaces of theelectrode layer 6 and the spacer layer 7 formed on the second supportsheet 4, the adhesive layer 10 of the adhesive layer sheet 11 istransferred onto the surface of the ceramic green sheet 2 of themulti-layered unit 20 to be newly laminated.

FIG. 11 is a schematic partial cross-sectional view showing a fourthstep of the lamination process of the multi-layered units 20.

As shown in FIG. 11, the new multi-layered unit 20 is positioned so thatthe surface of the adhesive layer 10 transferred onto the ceramic greensheet 2 comes into contact with the surface of the release layer 5 ofthe multi-layered unit 20 bonded onto the agglutinant layer 27 andpressure is applied to the new multi-layered unit 20 using a pressingmachine or the like.

As a result, the new multi-layered unit 20 is laminated on themulti-layered unit 20 bonded onto the agglutinant layer 27 via theadhesive layer 10 transferred onto the ceramic green sheet 2.

FIG. 12 is a schematic partial cross-sectional view showing a fifth stepof the lamination process of the multi-layered units 20.

When the new multi-layered unit 20 has been laminated on themulti-layered unit 20 bonded onto the agglutinant layer 27 via theadhesive layer 10 transferred onto the ceramic green sheet 2, the secondsupport sheet 4 of the new multi-layered unit 20 is peeled off from therelease layer 5 of the multi-layered unit 20, as shown in FIG. 12.

In this embodiment, the release layer 5 is formed on the surface of thesecond support sheet 4 so that the bonding strength between the secondsupport sheet 4 and the release layer 5 of the multi-layered unit 20 is5 to 20 mN/cm and the agglutinant layer 27 is formed on the surface ofthe base substrate 28 so that the bonding strength between theagglutinant layer 27 and the base substrate 28 is 20 to 350 mN/cm andthat the bonding strength between the agglutinant layer 27 and theceramic green sheet 2 of the multi-layered unit 20 is equal to or higherthan 350 mN/cm. Therefore, since the agglutinant layer 27 is formed onthe surface of the base substrate 28 so that the bonding strengthbetween the agglutinant layer 27 and the base substrate 28 is higherthan the bonding strength between the second support sheet 4 and therelease layer 5 of the multi-layered unit 20 and lower than the bondingstrength between the agglutinant layer 27 and the ceramic green sheet 2of the multi-layered unit 20 and the newly laminated multi-layered unit20 is bonded onto the multi-layered unit 20 bonded onto the agglutinantlayer 27 by the adhesive layer 10, it is possible to easily peel offonly the second support sheet 4 from the multi-layered unit 20 bondedonto the agglutinant layer 27.

Similarly to the above, multi-layered units 20 are sequentiallylaminated and a predetermined number of multi-layered units 20 arelaminated on the base substrate 28 fixed to the substrate 25, therebyfabricating a multi-layered block.

When a predetermined number of the multi-layered units 20 have beenlaminated on the base substrate 28 fixed to the substrate 25, therebyfabricating the multi-layered block, the multi-layered block fabricatedby laminating a predetermined number of the multi-layered units 20 onthe base substrate 28 fixed to the substrate 25 is laminated on an outerlayer of a multi-layered ceramic capacitor.

FIG. 13 is a schematic partial cross-sectional view showing a first stepof a lamination process of for laminating the multi-layered blocklaminated on the base substrate 28 fixed to the substrate 25 on theouter layer of the multi-layered ceramic capacitor.

As shown in FIG. 13, an outer layer 33 formed with an adhesive layer 10is set on a base 30 formed with a number of holes 31.

The outer layer 33 is sucked with air via the number of the holes 31formed in the base 30 and fixed at a predetermined position on the base30.

As shown in FIG. 13, the multi-layered block 40 laminated on the basesubstrate 28 sucked with air via a number of the holes 26 and fixed at apredetermined position on the substrate 25 is then positioned so thatthe surface of the release layer 5 of the last laminated multi-layeredunit 20 comes into contact with the surface of an adhesive layer 32formed on the outer layer 33.

Then, the suction operation with air via the number of the holes 26 isstopped and the substrate 25 is removed from the base substrate 28supporting the multi-layered block 40.

When the substrate 25 has been removed from the base substrate 28, apressure is applied onto the base substrate 28 using a pressing machineor the like.

As a result, the multi-layered block 40 is bonded onto the outer layer33 fixed to the base 30 via the adhesive layer 32 and laminated thereon.

FIG. 14 is a schematic partial cross-sectional view showing a secondstep of a lamination process for laminating the multi-layered block 40laminated on the base substrate 28 fixed to the substrate 25 on theouter layer 33 of the multi-layered ceramic capacitor.

When the multi-layered block 40 has been bonded via the adhesive layer32 onto the outer layer 33 fixed to the base 30 and laminated thereon,the base substrate 28 is peeled off from the agglutinant layer 27 of themulti-layered block 40, as shown in FIG. 14.

In this embodiment, the release layer 5 is formed on the surface of thesecond support sheet 4 so that the bonding strength between the secondsupport sheet 4 and the release layer 5 of the multi-layered unit 20 is5 to 20 mN/cm and the agglutinant layer 27 is formed on the surface ofthe base substrate 28 so that the bonding strength between theagglutinant layer 27 and the base substrate 28 is 20 to 350 mN/cm andthat the bonding strength between the agglutinant layer 27 and theceramic green sheet 2 of the multi-layered unit 20 is equal to or higherthan 350 mN/cm. Therefore, since the agglutinant layer 27 is formed onthe surface of the base substrate 28 so that the bonding strengthbetween the agglutinant layer 27 and the base substrate 28 is higherthan the bonding strength between the second support sheet 4 and therelease layer 5 of the multi-layered unit 20 and lower than the bondingstrength between the agglutinant layer 27 and the ceramic green sheet 2of the multi-layered unit 20, it is possible to easily peel off only thebase substrate 28 from multi-layered block 40 laminated on the outerlayer 33.

In this manner, the multi-layered block 40 including a predeterminednumber of the laminated multi-layered units 20 is laminated on the outerlayer 33 fixed onto the base 30 via the adhesive layer 32.

Further, in accordance with the steps shown in FIGS. 8 to 12, apredetermined number of the multi-layered units 20 are laminated on thebase substrate 28 fixed onto the base 30 to fabricate a multi-layeredblock 40 and the thus fabricated multi-layered block 40 is laminated onthe multi-layered block 40 laminated on the outer layer 33 fixed ontothe base 30.

FIG. 15 is a schematic partial cross-sectional view showing a third stepof a lamination process of for laminating the multi-layered block 40laminated on the base substrate 28 fixed to the substrate 25 on theouter layer 33 of the multi-layered ceramic capacitor.

As shown in FIG. 15, the multi-layered block 40 newly laminated on thebase substrate 28 sucked with air via a number of the holes 26 and fixedat a predetermined position on the substrate 25 is positioned so thatthe surface of the release layer 5 of the last laminated multi-layeredunit 20 comes into contact with the surface of the agglutinant layer 27of the multi-layered block 40 laminated on the outer layer 33.

Then, the suction operation with air via the number of the holes 26 isstopped and the substrate 25 is removed from the base substrate 28supporting the multi-layered block 40.

When the substrate 25 has been removed from the base substrate 28, apressure is applied onto the base substrate 28 using a pressing machineor the like.

In this embodiment, since the uppermost layer of the multi-layered block40 laminated on the outer layer 33 is constituted as the agglutinantlayer 27 peeled off from the base substrate 28 and remaining on the sideof the multi-layered block 40, when a multi-layered block 40 is to benewly laminated on the multi-layered block 40 laminated on the outerlayer 33, it is unnecessary to form an adhesive layer. Therefore, it ispossible to efficiently laminate multi-layered blocks 40.

As a result, the newly laminated multi-layered block 40 is bonded ontothe multi-layered block 40 laminated on the outer layer 33 fixed ontothe base 30 via the agglutinant layer 27 and laminated thereon.

FIG. 16 is a schematic partial cross-sectional view showing a fourthstep of a lamination process of for laminating the multi-layered block40 laminated on the base substrate 28 fixed to the substrate 25 on theouter layer 33 of the multi-layered ceramic capacitor.

When the newly laminated multi-layered block 40 has been bonded via theagglutinant layer 27 onto the multi-layered block 40 laminated on theouter layer 33 fixed onto the base 30 and laminated thereon, the basesubstrate 28 is peeled off from the agglutinant layer 27 of the newlylaminated multi-layered block 40, as shown in FIG. 16.

In this manner, the new multi-layered block 40 is bonded via theagglutinant layer 27 onto the multi-layered block 40 laminated on theouter layer 33 fixed onto the base 30 and is laminated thereon.

Similarly to the above, multi-layered blocks 40 each laminated on thebase substrate 28 fixed onto the substrate 25 are sequentially laminatedand a predetermined number of the multi-layered blocks 40, and,therefore, a predetermined number of the multi-layered units 20, arelaminated on the outer layer 33 of the multi-layered ceramic capacitor.

When a predetermined number of the multi-layered units 20 have beenlaminated on the outer layer 33 of the multi-layered ceramic capacitorin this manner, another outer layer (not shown) is bonded onto them viaan adhesive layer, thereby fabricating a laminated body including apredetermined number of the multi-layered units 20.

Then, the laminated body including the predetermined number of themulti-layered units 20 is cut to a predetermined size, therebyfabricating a number of ceramic green chips.

The thus fabricated ceramic green chips are placed in a reducing gasatmosphere so that the binder is removed therefrom and the ceramic greenchips are baked.

Necessary external electrodes are then attached to the thus bakedceramic green chip, thereby manufacturing a multi-layered ceramiccapacitor.

According to this embodiment, the agglutinant layer 27 is formed on thesurface of the base substrate 28, the multi-layered unit 20 includingthe release layer 5, the electrode layer 6, the spacer layer 7, theadhesive layer 10 and the ceramic green sheet 2 laminated on the secondsupport sheet 4 is laminated on the agglutinant layer 27 formed on thesurface of the base substrate 28 fixed onto the substrate 25 so that thesurface of the ceramic green sheet 2 of the multi-layered unit 20 comesinto contact with the surface of the agglutinant layer 27 and theagglutinant layer 27 is formed on the surface of the base substrate 28so that the boding strength between the agglutinant layer 27 and thebase substrate 28 is higher than the bonding strength between the secondsupport sheet 4 and the release layer 5 of the multi-layered unit 20 andlower than the bonding strength between the agglutinant layer 27 and theceramic green sheet 2 of the multi-layered unit 20. Therefore, in thecase of laminating a desired number of the multi-layered units 20 tomanufacture a multi-layered ceramic electronic component, it is possibleto effectively prevent the multi-layered units 20 from being damaged.

Further, according to this embodiment, since the release layer 5 isformed on the surface of the second support sheet 4 so that the bondingstrength between the second support sheet 4 and the release layer 5 ofthe multi-layered unit 20 is 5 to 20 mN/cm and the agglutinant layer 27is formed on the surface of the base substrate 28 so that the bondingstrength between the agglutinant layer 27 and the base substrate 28 is20 to 350 mN/cm and that the bonding strength between the agglutinantlayer 27 and the ceramic green sheet 2 of the multi-layered unit 20 isequal to or higher than 350 mN/cm, the agglutinant layer 27 is formed onthe surface of the base substrate 28 so that the bonding strengthbetween the agglutinant layer 27 and the base substrate 28 is higherthan the bonding strength between the second support sheet 4 and therelease layer 5 of the multi-layered unit 20 and lower than the bondingstrength between the agglutinant layer 27 and the ceramic green sheet 2of the multi-layered unit 20. Therefore, when the multi-layered block 40fabricated by laminating a predetermined number of the multi-layeredunits 20 on the agglutinant layer 27 of the base substrate 28 is bondedonto the adhesive layer 32 formed on the outer layer 33 of amulti-layered ceramic capacitor to be laminated thereon and the basesubstrate 28 is peeled off from the multi-layered block 40 laminated onthe outer layer 33 in order to further laminate a multi-layered block 40on the multi-layered block 40 laminated on the outer layer 33, sinceonly the base substrate 28 is peeled off and the agglutinant layer 27remains on the side of the multi-layered block 40, it is unnecessary toform an adhesive layer when a multi-layered block 40 is newly laminatedon the multi-layered block 40 laminated on the outer layer 33 and it istherefore possible to efficiently laminate multi-layered blocks 40.

Hereinafter, working examples and comparative examples will be set outin order to further clarify the advantages of the present invention.

WORKING EXAMPLE 1

Preparation of a Dielectric Paste for a Ceramic Green Sheet

Dielectric powders having the following composition were prepared.BaTiO₃ powders (“BT-02” (Product Name) 100 weight parts manufactured bySAKAI CHEMICAL INDUSTRY CO., LTD:) MgCO₃ 0.72 weight parts MnO 0.13weight parts (Ba_(0.5)Ca_(0.4))SiO₂ 1.5 weight parts Y₂O₃ 1.0 weightparts

An organic vehicle having the following composition was added to 100weight parts of the thus prepared dielectric powders and the resultantmixture was mixed using a ball mill for 20 hours, thereby preparing adielectric paste for a ceramic green sheet. polyvinyl butyral resin(binder) 6 weight parts bis(2-ethylhexyl)phthalate (DOP: plasticizingagent) 3 weight parts ethyl alcohol 78 weight parts n-propyl alcohol 78weight parts xylene 14 weight parts mineral spirit 7 weight partsdispersing agent 0.7 weight partsPreparation of a Dielectric Paste for a Release Layer

A dielectric paste was prepared in the manner of preparing thedielectric paste for a ceramic green sheet except that BaTiO₃ powders(“BT-02” (Product Name) manufactured by SAKAI CHEMICAL INDUSTRY CO.,LTD:) were used and the thus prepared dielectric paste was diluted by amixed solution of ethyl alcohol, propyl alcohol and xylene where themixture ratio was 42.5:42.5:15, thereby preparing a dielectric paste fora release layer.

Preparation of an Adhesive Agent Paste

An organic vehicle having the following composition was prepared and thethus obtained organic vehicle was diluted ten times by methyl ethylketone, thereby preparing a paste for an adhesive agent. polyvinylbutyral resin (binder) 100 weight parts bis(2-ethylhexyl)phthalate (DOP:plasticizing agent) 50 weight parts methyl ethyl ketone 900 weight partsPreparation of a Paste for an Electrode Layer

A solution having the following composition was added to 100 weightparts of Ni particles having an average diameter of 0.2 μm and theresultant mixture was mixed using a ball mill for 20 hours, therebypreparing a slurry. BaTiO₃ powders (“BT-02” (Product Name) 20 weightparts manufactured by SAKAI CHEMICAL INDUSTRY CO., LTD:) organic vehicle58 weight parts bis(2-ethylhexyl)phthalate (DOP: plasticizing agent) 50weight parts terpineol 5 weight parts dispersing agent 1 weight partsacetone 45 weight parts

Here, the organic vehicle was prepared by dissolving 8 weight parts ofpolyvinyl butyral resin into 92 weight parts of terpineol.

The thus obtained slurry was heated at 40° C. and agitated to volatilizeexcessive acetone, thereby preparing a paste for an electrode layer.

Preparation of a Dielectric Paste for a Spacer Layer

A solution having the following composition was added to 100 weightparts of the dielectric powders used for preparing the dielectric pastefor a ceramic green sheet and the resultant mixture was mixed for 20hours, thereby preparing slurry. organic vehicle 71 weight partspolyvinyl butyral resin (binder) 50 weight partsbis(2-ethylhexyl)phthalate (DOP: plasticizing agent) 5 weight partsterpineol 5 weight parts dispersing agent 1 weight parts acetone 64weight parts

Here, the organic vehicle was prepared by dissolving 8 weight parts ofpolyvinyl butyral resin into 92 weight parts of terpineol.

The thus obtained slurry was heated at 40° C. and agitated to volatilizeexcessive acetone, thereby preparing a dielectric paste for a spacerlayer.

Fabrication of a Ceramic Green Sheet

The surface of a first polyethylene terephthalate film was coated usinga wire bar coater with the dielectric paste for a ceramic green sheet toform a coating layer and the coating layer was dried, therebyfabricating a ceramic green sheet having a thickness of 1.5 μm.

Formation of a Release Layer, an Electrode Layer and a Spacer Layer

The surface of a second polyethylene terephthalate film was coated usinga wire bar coater with the dielectric paste for a release layer to forma coating layer and the coating layer was dried, thereby forming arelease layer having a thickness of 0.2 μm.

The surface of the thus formed release layer was printed using a screenprinting process with the paste for an electrode layer in apredetermined pattern, thereby forming an electrode layer having athickness of 1.0 μm.

Then, the surface of the release layer where no electrode layer wasformed was printed using a screen printing process with the dielectricpaste for a spacer layer in a complementary pattern to that of theelectrode layer, thereby forming a spacer layer having a thickness of1.0 μm.

Formation of an Adhesive Layer

The surface of a third polyethylene terephthalate film was coated usinga wire bar coater with the adhesive agent paste, thereby forming anadhesive layer having a thickness of 0.1 μm.

Transfer of an Adhesive Layer

Using the adhering and peeling apparatus shown in FIG. 5, the adhesivelayer formed on the third polyethylene terephthalate film was bondedonto the surfaces of the electrode layer and the spacer layer and thethird polyethylene terephthalate film was peeled off from the adhesivelayer, whereby the adhesive layer was transferred onto the surfaces ofthe electrode layer and the spacer layer.

The nip pressure of the pair of pressure rollers was 1 Mpa and thetemperature was 50° C.

Transfer of a Ceramic Green Sheet Onto the Surfaces of an ElectrodeLayer and a Spacer Layer

Using the adhering apparatus shown in FIG. 6, the electrode and spacerlayers, and the ceramic green sheet were bonded to each other via theadhesive layer transferred onto the surfaces of the electrode layer andthe spacer layer.

The nip pressure of the pair of pressure rollers was 5 Mpa and thetemperature was 100° C.

Then, the first polyethylene terephthalate film was peeled off from theceramic green sheet, thereby obtaining a multi-layered unit includingthe release layer, the electrode layer, the spacer layer, the adhesivelayer and the ceramic green sheet laminated on the second polyethyleneterephthalate film.

Preparation of a Base Substrate

An ethyl alcohol solution containing 1.5 weight % of polyvinyl butyraland 0.75 weight % of dioctylphthalate was prepared and the surface of asheet constituted as a polyethylene terephthalate film was coated withthe ethyl alcohol solution, thereby forming an agglutinant layer havinga thickness of 0.02 μm.

Then, the sheet formed with the agglutinant layer was cut to 60 mm*70 mmto fabricate a base substrate and the thus fabricated base substrate wasfixed onto a base.

Lamination of Multi-Layered Units

The multi-layered unit was positioned so that the surface of the ceramicgreen sheet of the multi-layered unit came into contact with the surfaceof the agglutinant layer formed on the base substrate and the pressureof 2 Mpa was applied to the multi-layered unit at a temperature of 50°C. for 5 seconds, thereby bonding and laminating the multi-layered unitonto the agglutinant layer formed on the base substrate.

Then, the second polyethylene terephthalate film was peeled off from therelease layer of the multi-layered unit.

Preparation of a New Multi-Layered Unit

Further, the surface of the third polyethylene terephthalate film wascoated using a wire bar coater with the adhesive agent paste to form anadhesive layer having a thickness of 0.1 μm. Then, using the adheringand peeling apparatus shown in FIG. 5, the adhesive layer formed on thesurface of the third polyethylene terephthalate film was bonded onto thesurface of the ceramic green sheet of a multi-layered unit to be newlylaminated and the third polyethylene terephthalate film was peeled offfrom the adhesive layer, whereby the adhesive layer was transferred ontothe surface of the ceramic green sheet of the multi-layered unit to benewly laminated.

Fabrication of a Multi-Layered Block

Further, the multi-layered unit to be newly laminated was positioned sothat the surface of the adhesive layer transferred onto the ceramicgreen sheet of the multi-layered unit to be newly laminated came intocontact with the surface of the release layer of the multi-layered unitlaminated on the base substrate and the pressure of 2 Mpa was applied tothe multi-layered unit to be newly laminated at a temperature of 50° C.for 5 seconds, thereby laminating the new multi-layered unit on themulti-layered unit laminated on the base substrate.

Afterward, the second polyethylene terephthalate film was peeled offfrom the release layer of the newly laminated multi-layered unit.

Similarly to the above, ten multi-layered units in total were laminatedon the base substrate, thereby fabricating a multi-layered block.

Further, similarly to the above, five multi-layered blocks eachincluding ten multi-layered units were fabricated.

Fabrication of a Ceramic Green Chip

An adhesive layer having a thickness of about 50 μm was formed on anouter layer constituting a lid portion of a multi-layered ceramiccapacitor. Then, the multi-layered block was positioned so that theceramic green sheet came into contact with the surface of the adhesivelayer and the pressure of 2 Mpa was applied to the multi-layered blockat a temperature of 50° C. for 5 seconds, thereby laminating themulti-layered block on the outer layer.

Afterward, the base substrate was peeled off from the multi-layeredblock.

Further, an adhesive layer having a thickness of about 50 μm was formedon the multi-layered block laminated on the outer layer. Then, amulti-layered block to be newly laminated was positioned so that theceramic green sheet of the new multi-layered block came into contactwith the surface of the adhesive layer formed on the multi-layered blocklaminated on the outer layer and the pressure of 2 Mpa was applied tothe new multi-layered block at a temperature of 50° C. for 5 seconds,thereby laminating the new multi-layered block on the multi-layeredblock laminated on the outer layer.

Similarly to the above, five multi-layered blocks in total werelaminated on the outer layer. Further, an adhesive layer having athickness of about 50 μm was formed on the uppermost multi-layered blockand the outer layer constituting a lid portion of a multi-layeredceramic capacitor was bonded onto the adhesive layer and laminated onthe multi-layered blocks.

The thus obtained laminated body including fifty multi-layered units waspressed under a pressure of 100 Mpa at a temperature of 40° C. for 30seconds to be subjected to the press forming and was then cut using adicing machine to a predetermined size, thereby fabricating a ceramicgreen chip.

Fabrication of a Multi-Layered Ceramic Capacitor

The thus fabricated ceramic green chip was processed under the followingconditions in a nitrogen gas atmosphere to remove the binder.

Temperature rising rate: 50° C./hour

Holding temperature: 400° C.

Holding time period: 2 hours

After removing the binder, the ceramic green chip was processed andbaked under the following conditions in a mixed gas atmosphere of anitrogen gas and a hydrogen gas whose temperature was controlled at the20° C.

Temperature rising rate: 300° C./hour

Holding temperature: 1240° C.

Holding time period: 3 hours

Cooling rate: 300° C./hour

The thus baked ceramic green chip was subjected to an annealingprocessing under the following conditions in an atmosphere of a nitrogengas whose dew point was controlled to 20° C.

Holding time period: 2 hours

Cooling rate: 300° C./hour

End surfaces of the thus obtained sintered body were polished and apaste for a terminal electrode was applied thereto and fired under thefollowing conditions in a mixed gas atmosphere of a nitrogen gas and ahydrogen gas whose dew point was controlled to 20° C., thereby formingterminal electrodes.

Temperature rising rate: 500° C./hour

Holding temperature: 700° C.

Holding time period: 10 minutes

Cooling rate: 500° C./hour

Further, the terminal electrodes were plated to fabricate a sample of amulti-layered ceramic capacitor.

The thus fabricated sample of the multi-layered ceramic capacitor hadfifty laminated layers of the ceramic green sheets and had a length of1.6 mm and a width of 0.8 mm.

Similarly to the above, twenty multi-layered ceramic capacitor sampleswere fabricated in total.

Characteristic Test

The electrostatic capacitance of each of these twenty multi-layeredceramic capacitor samples was measured using a digital LCR meter “4274A”(product name) manufactured by Yokokawa Hewlett-Packard DevelopmentCompany, L.P. The measurement was made under the conditions of areference temperature of 25° C., a frequency of 120 Hz and an inputsignal level (measurement voltage) of 0.5 Vrms.

Then, theoretical values of electrostatic capacitance (theoreticalelectrostatic capacitance) of the multi-layered ceramic capacitor samplewas calculated and the average value of the measured electrostaticcapacitances of the twenty multi-layered ceramic capacitor samples andthe theoretical electrostatic capacitance of the sample were compared,thereby calculating a reduction rate (%) of the average value of themeasured electrostatic capacitances with respect to the theoreticalelectrostatic capacitance. The reduction rate was found to exceed 10%but be equal to or smaller than 20%.

Here, the theoretical electrostatic capacitance of the sample wascalculated on the assumption that the compression rate was 0.67.

WORKING EXAMPLE 2

Twenty multi-layered ceramic capacitor samples were fabricated in themanner in Working Example 1 except that an agglutinant layer having athickness of 0.1 μm was formed on the base substrate in each sample andthe electrostatic capacitance of each sample was measured.

The average value of the measured electrostatic capacitances of thetwenty multi-layered ceramic capacitor samples and the theoreticalelectrostatic capacitance of the sample were compared, therebycalculating a reduction rate (%) of the average value of the measuredelectrostatic capacitances with respect to the theoretical electrostaticcapacitance. The reduction rate was found to be equal to or smaller than10%.

WORKING EXAMPLE 3

Twenty multi-layered ceramic capacitor samples were fabricated in themanner in Working Example 1 except that an agglutinant layer having athickness of 0.2 μm was formed on the base substrate in each sample andthe electrostatic capacitance of each sample was measured.

The average value of the measured electrostatic capacitances of thetwenty multi-layered ceramic capacitor samples and the theoreticalelectrostatic capacitance of the sample were compared, therebycalculating a reduction rate (%) of the average value of the measuredelectrostatic capacitances with respect to the theoretical electrostaticcapacitance. The reduction rate was found to be equal to or smaller than10%.

WORKING EXAMPLE 4

Twenty multi-layered ceramic capacitor samples were fabricated in themanner in Working Example 1 except that an agglutinant layer having athickness of 0.3 μm was formed on the base substrate in each sample andthe electrostatic capacitance of each sample was measured.

The average value of the measured electrostatic capacitances of thetwenty multi-layered ceramic capacitor samples and the theoreticalelectrostatic capacitance of the sample were compared, therebycalculating a reduction rate (%) of the average value of the measuredelectrostatic capacitances with respect to the theoretical electrostaticcapacitance. The reduction rate was found to exceed 10% but be equal toor smaller than 20%.

WORKING EXAMPLE 5

Twenty multi-layered ceramic capacitor samples were fabricated in themanner in Working Example 1 except that an agglutinant layer having athickness of 0.01 μm was formed on the base substrate in each sample andthe electrostatic capacitance of each sample was measured.

The average value of the measured electrostatic capacitances of thetwenty multi-layered ceramic capacitor samples and the theoreticalelectrostatic capacitance of the sample were compared, therebycalculating a reduction rate (%) of the average value of the measuredelectrostatic capacitances with respect to the theoretical electrostaticcapacitance. The reduction rate was found to exceed 10% but be equal toor smaller than 20%.

COMPARATIVE EXAMPLE 1

Twenty multi-layered ceramic capacitor samples were fabricated in themanner in Working Example 1 except that an agglutinant layer having athickness of 0.5 μm was formed on the base substrate in each sample andthe electrostatic capacitance of each sample was measured.

The average value of the measured electrostatic capacitances of thetwenty multi-layered ceramic capacitor samples and the theoreticalelectrostatic capacitance of the sample were compared, therebycalculating a reduction rate (%) of the average value of the measuredelectrostatic capacitances with respect to the theoretical electrostaticcapacitance. The reduction rate was found to exceed 20%.

COMPARATIVE EXAMPLE 2

Twenty multi-layered ceramic capacitor samples were fabricated in themanner in Working Example 1 except that an agglutinant layer having athickness of 1.0 μm was formed on the base substrate in each sample andthe electrostatic capacitance of each sample was measured.

The average value of the measured electrostatic capacitances of thetwenty samples of the multi-layered ceramic capacitors and thetheoretical electrostatic capacitance of the sample were compared,thereby calculating a reduction rate (%) of the average value of themeasured electrostatic capacitances with respect to the theoreticalelectrostatic capacitance. The reduction rate was found to exceed 20%.

From Working Examples 1 to 5 and the Comparative Examples 1 and 2, itwas found that in the case where the thickness of the agglutinant layerwas equal to or thinner than 0.3 μm, the reduction in the electrostaticcapacitance was small and within the allowable range but that in thecase where the thickness of the agglutinant layer was thicker than 0.3μm, the electrostatic capacitance was markedly lowered.

It is reasonable to assume that in the case where the thickness of theagglutinant layer was equal to or thinner than 0.3 μm, empty spaces thatformed in the multi-layered ceramic capacitor due the presence of theagglutinant layer were small, while in the case where the thickness ofthe agglutinant layer was thicker than 0.3 μm, empty spaces that formedin the multi-layered ceramic capacitor due to the presence of theagglutinant layer became large.

The present invention has thus been shown and described with referenceto a specific embodiment. However, it should be noted that the presentinvention is in no way limited to the details of the describedarrangements but changes and modifications may be made without departingfrom the scope of the appended claims.

For example, in the above described embodiment, the release layer 5 isformed on the surface of the second support sheet 4 so that the bondingstrength between the second support sheet 4 and the release layer 5 ofthe multi-layered unit 20 is 5 to 20 mN/cm and the agglutinant layer 27is formed on the surface of the base substrate 28 so that the bondingstrength between the agglutinant layer 27 and the base substrate 28 is20 to 350 mN/cm and that the bonding strength between the agglutinantlayer 27 and the ceramic green sheet 2 of the multi-layered unit 20 isequal to or higher than 350 mN/cm. However, it is sufficient to form theagglutinant layer 27 on the surface of the base substrate 28 so that thebonding strength between the agglutinant layer 27 and the base substrate28 is higher than the bonding strength between the second support sheet4 and the release layer 5 of the multi-layered unit 20 and lower thanthe bonding strength between the agglutinant layer 27 and the ceramicgreen sheet 2 of the multi-layered unit 20 and it is not absolutelynecessary to form the release layer 5 on the surface of the secondsupport sheet 4 so that the bonding strength between the second supportsheet 4 and the release layer 5 of the multi-layered unit 20 is 5 to 20mN/cm and to form the agglutinant layer 27 on the surface of the basesubstrate 28 so that the bonding strength between the agglutinant layer27 and the base substrate 28 is 20 to 350 mN/cm and that the bondingstrength between the agglutinant layer 27 and the ceramic green sheet 2of the multi-layered unit 20 is equal to or higher than 350 mN/cm.

Further, in the above described embodiment, the multi-layered unit 20 isfabricated by bonding the adhesive layer 10 formed on the third supportsheet 9 onto the surface of the electrode layer 6 and the spacer layer 7formed on the second support sheet 4, peeling off the third supportsheet from the adhesive layer 10 and bonding the ceramic green sheet 2to the electrode layer 6 and the spacer layer 7 via the adhesive layer10. However, it is not absolutely necessary to bond the adhesive layer10 formed on the third support sheet 9 onto the surface of the electrodelayer 6 and the spacer layer 7 formed on the second support sheet 4,peel off the third support sheet from the adhesive layer 10 and bond theceramic green sheet 2 to the electrode layer 6 and the spacer layer 7via the adhesive layer 10, thereby fabricating the multi-layered unit20, and it is possible instead to form a ceramic green sheet 2 byapplying a dielectric paste onto an electrode layer 6 and a spacer layer7 after they were dried, or it is possible to print an electrode pasteonto the surface of a ceramic green sheet 2 formed on a first supportsheet 1, thereby forming an electrode layer 6 and print a dielectricpaste thereonto, thereby forming a spacer layer 7.

Furthermore, in the above described embodiment, the electrode layer 6and the spacer layer 7 are formed on the release layer 5 so thatt_(s)/t_(e) is equal to 1.1, where t_(s) is the thickness of the spacerlayer 7 and t_(e) is the thickness of the electrode layer 6. However, itis sufficient to form an electrode layer 6 and a spacer layer 7 on therelease layer 5 so that t_(s)/t_(e) is equal to or larger than 0.7 andequal to or smaller than 1.2, preferably equal to or larger than 0.8 andequal to or smaller than 1.2 and more preferably equal to or larger than0.9 and equal to or smaller than 1.2, and it is not absolutely necessaryto form the electrode layer 6 and the spacer layer 7 on the releaselayer 5 so that t_(s)/t_(e) is equal to 1.1.

Moreover, in the above described embodiment, the electrode layer 6 andthe spacer layer 7 are formed on the release layer 5. However, it is notabsolutely necessary to form the electrode layer 6 and the spacer layer7 on the release layer 5 and only the electrode layer 6 can be formed onthe release layer 5 without forming the spacer layer 7 on the releaselayer 5.

Further, although in the above described embodiment the adhesive layer10 contains the surfactant, it is not absolutely necessary for theadhesive layer 10 to contain a surfactant.

Furthermore, in the above described embodiment, the agglutinant layer 27contains an imidazoline system surfactant in an amount of 0.01 weight %to 15 weight % of the binder. However, it is not absolutely necessaryfor the agglutinant layer 27 to contain an imidazoline system surfactantin an amount of 0.01 weight % to 15 weight % of the binder. Theagglutinant layer 27 may contain an ampholytic surfactant such as apolyalkylene glycol derivative system surfactant, a carboxylic acidamidine salt system surfactant and the like, or it may contain asurfactant other than an ampholytic surfactant. Further, it is notabsolutely necessary for an agglutinant layer 27 to contain asurfactant.

Moreover, in the above described embodiment, the ceramic green sheet 2is bonded onto the surfaces of the electrode layer 6 and the spacerlayer 7 via the adhesive layer 10 using the adhering apparatus shown inFIG. 6 and the first support sheet 1 is then peeled off from the ceramicgreen sheet 2. However, it is possible to bond the ceramic green sheet 2onto the surfaces of the electrode layer 6 and the spacer layer 7 viathe adhesive layer 10 and peel off the first support sheet 1 from theceramic green sheet 2 using the adhering and peeling apparatus shown inFIG. 5.

According to the present invention, it is possible to provide a methodfor manufacturing a multi-layered ceramic electronic component which canreliably prevent a multi-layered unit including a ceramic green sheetand an electrode layer from being damaged and efficiently laminate adesired number of the multi-layered units, thereby manufacturing themulti-layered ceramic electronic component.

1. A method for manufacturing a multi-layered ceramic electroniccomponent by laminating a plurality of multi-layered units each formedby laminating a release layer, an electrode layer and a ceramic greensheet on a support sheet in this order, the method comprising steps ofpositioning the multi-layered unit on a base substrate so that thesurface of the ceramic green sheet is contact with an agglutinant layerformed on the surface of the base substrate in such a manner that thebonding strength between itself and the support substrate is higher thanthe bonding strength between the support sheet and the release layer andlower than the bonding strength between itself and the ceramic greensheet, pressing it and laminating multi-layered units on the basesubstrate.
 2. A method for manufacturing a multi-layered ceramicelectronic component in accordance with claim 1, wherein the agglutinantlayer has a thickness of 0.01 μm to 0.3 μm.
 3. A method formanufacturing a multi-layered ceramic electronic component in accordancewith claim 1, wherein the agglutinant layer contains a binder belongingto the same binder group as that a binder contained in the ceramic greensheet belongs to.
 4. A method for manufacturing a multi-layered ceramicelectronic component in accordance with claim 2, wherein the agglutinantlayer contains a binder belonging to the same binder group as that abinder contained in the ceramic green sheet belongs to.
 5. A method formanufacturing a multi-layered ceramic electronic component in accordancewith claim 1, wherein the agglutinant layer contains a plasticizingagent belonging to the same plasticizing agent group as that aplasticizing agent contained in the ceramic green sheet belongs to.
 6. Amethod for manufacturing a multi-layered ceramic electronic component inaccordance with claim 2, wherein the agglutinant layer contains aplasticizing agent belonging to the same plasticizing agent group asthat a plasticizing agent contained in the ceramic green sheet belongsto.
 7. A method for manufacturing a multi-layered ceramic electroniccomponent in accordance with claim 1, wherein the agglutinant layercontains dielectric particles having the same composition as that ofdielectric particles contained in the ceramic green sheet.
 8. A methodfor manufacturing a multi-layered ceramic electronic component inaccordance with claim 2, wherein the agglutinant layer containsdielectric particles having the same composition as that of dielectricparticles contained in the ceramic green sheet.
 9. A method formanufacturing a multi-layered ceramic electronic component in accordancewith claim 1, wherein the agglutinant layer contains an ampholyticsurfactant in an amount smaller than that of the binder.
 10. A methodfor manufacturing a multi-layered ceramic electronic component inaccordance with claim 2, wherein the agglutinant layer contains anampholytic surfactant in an amount smaller than that of the binder. 11.A method for manufacturing a multi-layered ceramic electronic componentin accordance with claim 1, wherein the base substrate is formed of aplastic material selected from a group consisting of polyethylene,polypropylene, polycarbonate, polyphenylene ether and polyethyleneterephthalate.
 12. A method for manufacturing a multi-layered ceramicelectronic component in accordance with claim 2, wherein the basesubstrate is formed of a plastic material selected from a groupconsisting of polyethylene, polypropylene, polycarbonate, polyphenyleneether and polyethylene terephthalate.
 13. A method for manufacturing amulti-layered ceramic electronic component in accordance with claim 1,wherein the ceramic green sheet has a thickness equal to or thinner than3 μm.
 14. A method for manufacturing a multi-layered ceramic electroniccomponent in accordance with claim 2, wherein the ceramic green sheethas a thickness equal to or thinner than 3 μm.
 15. A method formanufacturing a multi-layered ceramic electronic component in accordancewith claim 1 which further includes steps of peeling off the supportsheet from the release layer of the multi-layered unit laminated on thebase substrate and further laminating a new multi-layered unit in whichan adhesive layer is formed on the surface of a ceramic green sheet ontothe release layer of the multi-layered unit laminated on the basesubstrate via the adhesive layer.
 16. A method for manufacturing amulti-layered ceramic electronic component in accordance with claim 2which further includes steps of peeling off the support sheet from therelease layer of the multi-layered unit laminated on the base substrateand further laminating a new multi-layered unit in which an adhesivelayer is formed on a ceramic green sheet onto the release layer of themulti-layered unit laminated on the base substrate via the adhesivelayer.
 17. A method for manufacturing a multi-layered ceramic electroniccomponent in accordance with claim 1, wherein the multi-layered unitincludes a spacer layer formed on the surface of the release layer in acomplementary pattern to that of the electrode layer.
 18. A method formanufacturing a multi-layered ceramic electronic component in accordancewith claim 2, wherein the multi-layered unit includes a spacer layerformed on the surface of the release layer in a complementary pattern tothat of the electrode layer.